id	author	title	date	pages	extension	mime	words	sentences	flesch	summary	cache	txt
work_5xauxfpkpffzjmeon76ftymtxi	Jao-Hwa Kuang	The Effect of Residual Stress on Coupling Power Loss of VCSEL Modulus	2016	4	.pdf	application/pdf	2034	293	73	The Effect of Residual Stress on Coupling Power Loss of VCSEL In this article, the effect of residual stress on active region misalignment of laser light sources for vertical introduced from the residual stress distribution variation for different VCSEL solder joints, i.e. tin-silver (Sn/3.5Ag) and tin-lead (Sn/37Pb) solder joints, are simulated by employing the thermal-elastic-plastic finite element model of MARC The optical coupled power of a VCSEL modulus depends upon residual stress distribution To assemble the VCSEL modulus, SMT uses different solder ball joints, such as Fig.3 Reflow process for VCSEL using Sn/37Pb solder joints. residual stress distribution of Sn/37Pb solder joints used by the VCSEL modulus for the reflow process. Fig.5 Displacement of point A of VCSEL using Sn/37Pb solder joints the reflow process, the VCSEL structure and fiber are jointed. Table.2 Active region displacement (µm)/ Optical coupled power loss for different solder ball grid array joints 	./cache/work_5xauxfpkpffzjmeon76ftymtxi.pdf	./txt/work_5xauxfpkpffzjmeon76ftymtxi.txt