id	author	title	date	pages	extension	mime	words	sentence	flesch	summary	cache	txt
pc289g57846	David Kopp	Microwave Performance and Fabrication Of Quilt Packaging, a Novel Chip-To-Chip Interconnect Technology	2014		.txt	text/plain	284	10	30	For such millimeter-wave systems, the bandwidth of individual interconnects is paramount, and the packing densities are far less important. For modern digital systems, the number of interconnects is small compared to the number of active devices on the chip, and given the high data processing throughput of many modern systems, the interconnects are by necessity shared or multiplexed.	cache/pc289g57846.txt	txt/pc289g57846.txt