id	author	title	date	pages	extension	mime	words	sentence	flesch	summary	cache	txt
wm117m03x1v	Qing Liu	Quilt Packaging: A Novel High Speed Chip-to-Chip Communication Paradigm for System-in-Package	2007		.txt	text/plain	341	15	49	As state-of-the-art transistor features continue to shrink and the incorporation of high-k, low-k isolation dielectric materials and strained and SiGe layers on silicon becomes common, chip density and performance are improved. As a result, several technologies, such as system-on-chip, system-in-packaging and system-on-packaging, have been actively pursed to meet the demands of low power, high I/O counts and fast chip-to-chip communication.	cache/wm117m03x1v.txt	txt/wm117m03x1v.txt