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news-002079		Notre Dame researchers introduce “Quilt Packaging” to address interchip interconnect problem | News | Notre Dame News | University of Notre Dame			.html	text/html	603	23	39	University of Notre Dame Skip To Content Skip To Navigation Skip To Search University of Notre Dame Notre Dame News Experts ND in the News Subscribe About Us Home Contact Search Menu Home › News › Notre Dame researchers introduce “Quilt Packaging” to address interchip interconnect problem Notre Dame researchers introduce “Quilt Packaging” to address interchip interconnect problem Published: October 09, 2006 Author: William G. Gilroy A team of University of Notre Dame researchers led by Gary H. Bernstein, professor of electrical engineering, has demonstrated a new technology for inter-computer chip communication calledQuilt Packagingthat may further the evolution of high-performance electronic systems. Contact: * _Gary H. Bernstein, professor of electrical engineering, 574-631-6269, Gary.H.Bernstein.1@nd.edu _ TopicID: 19544 Home Experts ND in the News Subscribe About Us For the Media Contact Office of Public Affairs and Communications Notre Dame News 500 Grace Hall Notre Dame, IN 46556 USA Facebook Twitter Instagram YouTube Pinterest © 2022 University of Notre Dame Search Mobile App News Events Visit Accessibility Facebook Twitter Instagram YouTube LinkedIn	cache/news-002079.html	txt/news-002079.txt